Advanced Research

Advances in processor technologies not only result in increasing power consumption, but as device geometries decrease, losses due to leakage currents increase while the surface area of the die from which heat must be extracted decreases. This leads to a need to continually innovate in techniques for extracting heat from devices, boards and systems.

By combining the capabilities of our engineers who have been working on rugged COTS since its inception with those of the researchers at GE’s Global Research Centers, GE Intelligent Platforms is uniquely placed to advance the state of the art in thermal management techniques. Advances come from both internal and external research, such as DARPA contracts. By working on leading edge technologies such as Thermal Ground Planes and Near Junction Cooling of devices as research programs, then transitioning them to deployable implementations, higher power devices can deployed and junction temperatures can be reduced, leading to better reliability and mean time before failure.

GE’s engineers take a holistic approach to thermal engineering of a system. They address issues at every stage of heat extraction from the device level, through the board assembly and heatsinking, the thermal interface to the chassis and from the chassis to the final dissipation to the environment. Only by using such an approach can the deployed system be truly regarded as being optimal.

By partnering with GE Intelligent Platforms on your system design, you can be assured of having access to the very best techniques that can be employed to bring the most reliable solution to deployment in the shortest time.