Testing and Qualification

Our comprehensive ISO9001/AS9100-certified development process lowers development costs, reduces non-recurring engineering costs, and dramatically cuts system program risks. In addition, project time-to-market is improved because both the Technology Readiness Level (TRL) and Manufacturing Readiness Level (MRL) will be much higher with our subsystem technologies than through the development of analogous proprietary systems.

Qualification Testing

Our Qualification Test Plan and Qualification Test Report documentation services provide further risk protection for system developers. Typically, the qualification cycle would start with Functional testing, followed by Thermal Cycling, Shock, Random Vibration, Thermal Vacuum, and Electromagnetic Radiation tests. An Open Box Inspection would be conducted after completion of testing.

Functional Testing

Several Functional Tests (FTs) are performed on every product during the qualification test cycle. Although the FT is most frequently an automated process, user intervention may be warranted in some situations.

Thermal Design and Qualification

Sophisticated thermal analysis computer modeling is conducted early in the product design process. These computer simulations evaluate chassis and subassembly performance in worst-case thermal environments. This testing will predict junction temperatures between components, as well as suggest design modifications that would be expected to improve thermal survivability.

Shock and Vibration Analysis and Qualifications

Shock and vibration testing simulates qualification-level impacts on the chassis and subassemblies in order to predict potential areas of noncompliance. Our engineers often incorporate this valuable test information into future design modifications.

EMI Qualification

Electromagnetic interference and susceptibility testing on our products is conducted by an approved subcontractor. These tests typically include: Electromagnetic Compatibility (EC); Electromagnetic Interference (EMI); electrostatic charge control and dissipation; preclusion of an Electromagnetic Radiation Hazard (EMRADHAZ); and proper electrical bonding for MIL-STD-464.

Engineering Development Units

After subsystem requirements have been finalized, we can provide engineering development units (EDUs) to facilitate software development in advance of completed subsystem hardware. These EDUs include representative conduction-cooled boards with appropriate connectors or rear translation modules.